set v0.3 in pcb

KiCad/CanGrow/CanGrow.kicad_pcb

@@ -75,41 +75,6 @@
 			(layer "B.SilkS"
 				(type "Bottom Silk Screen")
 			)
-			(layer "F.SilkS"
-				(type "Top Silk Screen")
-			)
-			(layer "F.Paste"
-				(type "Top Solder Paste")
-			)
-			(layer "F.Mask"
-				(type "Top Solder Mask")
-				(thickness 0.01)
-			)
-			(layer "F.Cu"
-				(type "copper")
-				(thickness 0.035)
-			)
-			(layer "dielectric 2"
-				(type "core")
-				(thickness 1.51)
-				(material "FR4")
-				(epsilon_r 4.5)
-				(loss_tangent 0.02)
-			)
-			(layer "B.Cu"
-				(type "copper")
-				(thickness 0.035)
-			)
-			(layer "B.Mask"
-				(type "Bottom Solder Mask")
-				(thickness 0.01)
-			)
-			(layer "B.Paste"
-				(type "Bottom Solder Paste")
-			)
-			(layer "B.SilkS"
-				(type "Bottom Silk Screen")
-			)
 			(copper_finish "None")
 			(dielectric_constraints no)
 		)
@@ -15205,7 +15170,7 @@
 		(layer "Edge.Cuts")
 		(uuid "168af8e7-4c35-4133-b125-59b64581bbfa")
 	)
-	(gr_text "CanGrow v0.2\n2024 by DeltaLima"
+	(gr_text "CanGrow v0.3\n2024 by DeltaLima"
 		(at 168 35.2 0)
 		(layer "B.Cu")
 		(uuid "84627cee-173f-446b-bc4a-0e03dc001982")

KiCad/CanGrow/CanGrow.kicad_sch

@@ -7,7 +7,7 @@
 	(title_block
 		(title "CanGrow")
 		(date "2024-04-01")
-		(rev "0.2")
+		(rev "0.3")
 		(company "DeltaLima")
 	)
 	(lib_symbols